德国ERS是半导体制造行业热管理解决方案的领导者，于1970年生产了第一套用于晶圆级测试的热卡盘单元，自此一直引领行业。
其高低温卡盘单元主要特点有：

1.出色的卡盘平整度
Maximum surface flatness ensures ideal contact area for the wafer. The extremely rigid ERS chucks are easily able to withstand the thermal and force stresses encountered in the use of high pin-count probe cards.

2.宽温度控制范围
ERS chuck systems are available for both extremely high and extremely low temperatures. For analytical probing applications, ERS also offers various temperature ranges between -65 °C to +400 °C.

3.快速的温度爬升
For analytical and production test applications calling for fast temperature change, cooling and heating times become particularly important for wafer test throughput. ERS' know-how in heat-exchanger technology and air flow management are behind the fast ramping times.

4.高控温精度，出色的温度一致性（±0.03°C的温度稳定性；±0.1°C的热均匀性）
Constant temperature distribution across the ERS chuck assures that the same base conditions apply to every chip on the wafer during test. ERS systems typically offer temperature uniformity of better than ± 0.5 °C across a 300 mm chuck.

5.超低的电气噪声，可应用于fA级测试场景
Experience in test measurement technology provides ERS systems with the best electrical performance on its chucks. Additionally, the use of low-noise DC temperature controlling and electrically quiet air-cooling ensures that the systems are suitable for testing in the femto-Ampere range.

6.可靠性和超长的使用寿命
Air-cooled systems from ERS have recorded MTBF values of more than 50,000 hours – almost six years uptime without interruption.

7.最小的空间要求
Thanks to the AC² efficient heat exchanging technology, ERS chillers can provide chuck temperatures down to -65 °C at an impressively small footprint unmatched by other thermal wafer chuck systems.
The patented AC² technology also allows for a high degree of integration into industry standard wafer probers, further shrinking the clean room footprint.

测芯科技CHIPTEST致力于国内高端半导体测试设备的研发、生产和推广，为用户提供优质的产品和服务。在面对苛刻测试要求时，搭载ERS精密卡盘单元的探针台系统，将能更好的帮助用户准确、可靠、高效的获得测试数据，让测试更有信心！助力国内半导体行业的发展。